*Beta availability. Official release in 2024
*Beta availability. Official release in 2024
*Beta availability. Official release in 2024
ThermoLink® products combine class-leading self-healing capabilities, high intrinsic breakdown strength, high energy density, and high temperature handling capabilities in a low profile, prismatic package ideally suited for a wide array of applications including automotive, aerospace, medical, industrial, and many others.
ThermoLink™ capacitors are made up of multiple, individually tested, self-healing, NanoLam™ elements. Elements are designed to meet voltage, ESR, and other technical requirements.
NanoLam™ elements are stacked, connected in parallel, tested, and terminated prior to packaging.
NanoLam™ blocks are placed in a plastic housing and are encapsulated in a high temperature, thermal conductive, potting compound that is V-zero rated for the most demanding applications.
NanoLam™ features consistent and stable capacitance across wide frequency, temperature, and voltage ranges making them ideal substitutes for ceramic capacitors in most power electronics applications.
Compared to polypropylene film capacitors currently available on the market.
Compared to polypropylene and multi-layer ceramic capacitors.
