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Breakthrough Capacitor Innovation

NanoLam Powered™ capacitor products combine high intrinsic breakdown strength, high dielectric constant, and prismatic form factor to feature energy density and specific energy values that are often multiple times higher than competing capacitor technologies. NanoLam technology is an ideal platform for systems requiring a new level of performance.

up to > 10x
Increased Energy Density

Compared to polypropylene and multi-layer ceramic capacitors.

up to > 125ºc
Operating Temperature Rating

NanoLam™ elements are able to withstand temperatures as high as 180ºC. *Subject to packaging materials.

UP TO > 2x
Thermal Conductivity

Compared to polypropylene film capacitors.

 < 1.0µm
Sub-Micron Dielectric Thickness

100% self-healing, NanoLam™ dielectric layers range in thickness from 300nm to 750nm.

greater than45%
Higher Dielectric Constant

Application specific thermoset dielectrics capable with dielectric constants of at least 3.2 compared to 2.2 for polypropylene.

up to > 50%
Lower Inductance

Smaller form factor, prizmatic shape,  and other unique design factors mean significantly reduced inductance.

Revolutionary Production Process

Fully Integrated, Fully Scalable Production

NanoLam™ technology uniquely integrates dielectric formation, electrode deposition and winding within a singular vacuum environment. This streamlined approach consolidates traditionally separate manufacturing stages into a singular process. This integration not only leads to superior electrical properties and consistency; but also markedly reduces contamination risks and material handling issues. Additionally, by simplifying the production workflow, NanoLam™ technology offers considerable cost-saving advantages. This novel process is particularly advantageous for applications demanding high precision and reliability, offering both performance and economic benefits.

Integrated

2  materials. 1 Machine. Liquid resin and metal wire are combined in a single machine to create a multi-layer NanoLaminate capacitor material.

Traceable

Full traceability. The NanoLam™ material is processed to create functional NanoLam™ capacitor elements, all fully electrically tested.

Flexibility

Dynamic Form Factor. Tested NanoLam™ elements are combined to create a prismatic block; terminated and packaged prior to shipment.

Proven Performance

NanoLam™ for Motorsports

Technology Advantages

NanoLam™ Powered products feature consistent and stable capacitance across wide frequency, temperature, and voltage ranges making them ideal substitutes for ceramic capacitors in most power electronics applications with key advantages from chemistry to self-healing safety properties.

NanoLam™ Products

Advanced Dielectric Chemistry

NanoLam™ Powered capacitors feature thermoset dielectric systems formulated for high dielectric constant, operation at high temperature, and excellent self-healing properties. NanoLam™ dielectrics offer unparalleled thermal stability, robust mechanical strength, and superior chemical resistance. Their durability and dimensional stability under extreme conditions make them ideal for demanding environments ensuring long-term reliability and performance.

Sub-micron Dielectric Formation

The NanoLam™ process leverages a proprietary flash evaporation method to create uniform super-thin dielectric layers featuring high intrinsic breakdown strength. Thickness can vary depending on the specific use case and can range from 0.20µm to 1.00µm. Voltage ratings can range between 48VDC to as high as > 2kVDC. NanoLam Powered™ means exceptional capacitance and energy density in a compact, prismatic, form factor featuring reliability and longevity under the highest electrical stress.

Advanced Safety Features

NanoLam™ Powered capacitors exhibit excellent self-healing properties while negating thermal runaway risks ensuring integrity under high current conditions. The fail-open design curtails short-circuit hazards post-failure. NanoLam Powered™ products have a single failure mode - capacitance loss due to electrode corrosion over time enhancing failure predictability and system safety.